SMD-Push through terminal block with push wire contacts, 1 pole

Direct insertion of solid and stranded, tinned wire ends

Wires can be released by twisting and pulling the wire simultaneously.

Mounting and wiring position: PCB bottom side

Ballast and PCB terminal block on one level

Machine-compatible "tape-and-reel" packaging

Fixing: Lead-free reflow soldering according to DIN EN 610760-1, section 6

Note 1: Maximum thickness of PCB and heatsink should not exceed 3.6 mm
Note 2: Recommendation for opening in heatsink is shown with minimum diameter. For other shaped pockets in heatsink the minimum creepage and clearance distances and manufacturing tolerances have to be considered.
Note 3: Recommended dimension for opening in PCB
Note 4: Recommended dimension for solder mask
Note 5: For metal core PCBs the minimum creepage distance has to be guaranteed
Note 6: Recommended pick & place area #1
Note 7: Recommended pick & place area #2 inside of the connector. Max. diameter of nozzle is 2.5 mm.
Note 8: Distance from center of mass to pick and place area #1 and #2
General note: It is recommended to make an electrical connection between both poles of each polarity on the solder mask
Other packaging units on request